Hybrid Micro Circuit Packages
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Detailed Specifications
Packages : Hermetically Sealed, Metal / Ceramic
Types of HMC’s :
Crossover (Two layer), Multilayer, Power HMC’s, Digital & Analog HMC’s, Multi Chip Modules
0.7” X 0.7” TO 1.0” X 4”
Conductor Line width & spacing : Min 6 mil
No. of conductor layers : 2 to 6 Layers
Wire bonding, Gold : 0.7 mil to 1.5 mil
Wire bonding, Aluminium : 1 mil to 5 mil
AS PER MIL STD 883 G