Electronics Manufacturing Services
Service Capabilities
1. BGA – Upto 0.3 mm pitch
2. QFN & fine pitch components
3. RoHS compliant
4. Package Size – from 0201 onwards
5. Layers – Upto 30 with metal embedded PCB’s
6. Automated Optical Inspection (AOI)
7. Manual soldering – fine pitch components
Service Standards
1. IPC 610 D
2. J Standard 001
Modules
Communication Modules
1
Displays
2
Analog Modules
3
Analog to Digital Conversion
4
RF Modules
5
Processors
6
Approvals
1. HAL
2. ISO 9001